The CMI165 provides unique temperature compensated Copper thickness measurements in an ergonomic hand-held device.

Measurements on Copper are affected by the temperature of the sample.  The CMI 165 accounts for temperature in the measurement of thickness ensuring accurate in-process inspection results regardless of Copper temperature.  This versatile, portable gauge equipped with protective case, has a rugged and durable design that allows it to be taken into the harshest environments.

Measure hot or cold Cu on PCBs

Reduce waste by eliminating the need for coupons

Measure foil or laminated Cu thickness in μm,mils or oz

Sort Cu by weight at incoming drilling, shearing or plating

Quantify Cu thickness after etching or planarizing

Verify Cu plating thickness on PCB surfaces

SRP-T1 Replaceable Probe Tip - no recalibration necessary

Spare SRP-T1 ensures no factory downtime

Illuminated probe tip for easy positioning on copper traces

User Interface available in both English and Simplified Chinese